Hi guys, these were my first experiences of delidding on scrap processors, before I actually got my hands on a pair of X5960s.
Don't mind the razor blade damage on the PCB or the blown components during opening. I was wondering if I removed enough of the liquid metal in the middle, or went too deep. On all the processors I've tried on, I've noticed that I've gotten to green areas in the centre.
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Green areas in the center?
It’s usually not (if ever) Liquid Metal in between the die/chip/silicon and the IHS. Indium is probably what you are referring to. Buy a big bottle of Fitz polish and you can get it all off without a razor blade etc. it will take more time but has no risk of a slip up.
The die should end up being shiny, so I am surprised to hear you are getting to a “green area” in the center.
Are you lapping (Sanding down) the die?