I don’t think that trying to “keep it in place” is the best idea.
You want the thermal interface material to be as thin as possible for the best performance. If it can’t escape and spread out to the sides, it may be too thick to provide acceptable cooling.
At least you shouldn’t place the barrier directly next to the die.
Pro4791
None. Like any thermal “paste” it needs to be able to squish out.
k2ui
If it’s coming out from under the heat sink, you might have put too much on
RenatsMC
Heat resistant tape.
Bront20
It’s non-conductive, so it’s fine, let it flow.
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SoggyBagelBite
It’s supposed to do that and it’s not conductive.
drbomb
That’s… the whole point of it though.
Ragnaraz690
It doesnt need it. It’s thinker than the gap, once it gets heat cycled the excess squishes out. Due to its physical nature you dont need to worry about pump or anything. It stays where it should when the excess has migrated.
10 Comments
I don’t think that trying to “keep it in place” is the best idea.
You want the thermal interface material to be as thin as possible for the best performance. If it can’t escape and spread out to the sides, it may be too thick to provide acceptable cooling.
At least you shouldn’t place the barrier directly next to the die.
None. Like any thermal “paste” it needs to be able to squish out.
If it’s coming out from under the heat sink, you might have put too much on
Heat resistant tape.
It’s non-conductive, so it’s fine, let it flow.
[deleted]
It’s supposed to do that and it’s not conductive.
That’s… the whole point of it though.
It doesnt need it. It’s thinker than the gap, once it gets heat cycled the excess squishes out. Due to its physical nature you dont need to worry about pump or anything. It stays where it should when the excess has migrated.
I don’t see a problem here